I. Core Performance Highlights
Precision Temperature Control System
Equipped with Japanese imported PID intelligent temperature controllers and K-type thermocouples, achieving ±1°C temperature control accuracy.
Multi-segment program control (20 programs × 20 segments) meets complex process curve requirements, especially suitable for the stepwise binder burnout process of electronic ceramics.

Efficient Hot Air Circulation Design
Squirrel-cage heaters combined with SUS304 stainless steel furnace chambers ensure ±3°C temperature uniformity.
Four-layer rack structure (850×700×900mm) enables batch processing with a capacity of 0.54m³.

Safety Protection System
Triple alarm protection (overtemperature/thermocouple breakage/overload) combined with surface temperature rise control <35°C.
Optional nitrogen protection function (240LPM flow rate) prevents material oxidation.

II. Key Usage Considerations
Installation Requirements
Foundation load-bearing capacity must be >500kg/m²; vibration-damping pads are recommended.
Exhaust system must maintain a minimum extraction capacity of 15m³/h; activated carbon adsorption towers are recommended for exhaust gas treatment.

Gas Source Management
Compressed air must undergo triple filtration (oil-water separation + precision filtration + drying tower).
Nitrogen purity is recommended to be ≥99.9% (for sensitive material processing).

Energy Consumption Optimization
Idle furnace power consumption ≤5kW; nighttime binder burnout mode is recommended.
Loading rate of material trays should be maintained at 70%-80% for optimal thermal efficiency.

III. Typical Application Parameter Configurations
Process Type | Temperature Setting | Heating Rate | Holding Time | Gas Flow
Electronic Ceramic Binder Burnout | 150±3°C | 2°C/min | 4-6h | Nitrogen 60LPM
Dielectric Paste Drying | 80±1°C | 5°C/min | 2h | Compressed Air 30LPM