1.Typical applications:

Primarily used for drying, debinding, and curing of electronic components in vacuum or controlled atmosphere environments.

Vacuum ovens are primarily designed for the low-temperature processing of electronic components under vacuum and protective atmospheres.

2.Parameter characteristics:

Model:​​ Vacuum Oven

​Key Features & Specifications​
​Primary Application: Designed for ​low-temperature processing of electronic components​ under ​vacuum or protective atmosphere.
​Chamber Dimensions: 500×700×550mm (W×H×D)
​Temperature Range:
​Max Temperature: 250°C
​Operating Temperature: RT ~ 200°C
​Heating System:
​Aluminum heating plates​ for uniform heat distribution
​Ceramic fiber insulation​ for high thermal efficiency
​Temperature Control:
​4-zone independent control​ (4 heating plates, individually regulated)
​Yamatake NX-D15 intelligent programmable temperature control module​ (Japan)
​Power Supply:
​380/220±10%V, 3-phase 5-wire, 50Hz​
​Power Consumption:
​Max Power: 4×1.5kW (6kW total)
​Weight: Approx. ​600kg​
​Applications​
​Electronics Manufacturing: Drying, curing, and annealing of ​PCBs, semiconductors, and sensitive electronic components.
​Materials Processing: Low-temperature heat treatment under ​inert gas or vacuum conditions.
​R&D & Laboratory Use: Precise thermal processing with ​multi-zone temperature control.
​Installation & Operation Notes​
Requires ​stable 3-phase power supply​ and proper grounding.
Suitable for ​cleanroom or controlled environments​ to prevent contamination.
​Multi-zone heating​ ensures uniform temperature distribution for large or batch-processed components.
This vacuum oven is ideal for industries requiring ​precise, low-temperature thermal processing​ with ​high uniformity and atmosphere control.

3.Delivery Checklist

4. Equipment Normal Operating Conditions
4.1 Environmental Conditions: Temperature 0~40°C, humidity ≤80% RH, no corrosive gases, no strong airflow disturbances.
4.2 Gas Supply Requirements:

High-purity nitrogen (process protective gas): Purity >99.999%, inlet pressure 0.1~0.2MPa.
Dry, clean, oil-free compressed air (purge gas): Inlet pressure 0.4~0.8MPa.
4.3 Ventilation System: Non-contact connection to user's exhaust system, exhaust capacity >10m³/h.
4.4 Floor Requirements: Level surface, minimal vibration, load-bearing capacity >200kg/m².
4.5 Power Supply: Capacity >8kVA, three-phase five-wire system, AC380V, 50Hz. Phase wires: Yellow, Green, Red; Neutral wire: Blue; Ground wire: Yellow-green.
4.6 Installation Space: 2000mm×2000mm×3000mm (Depth×Width×Height), installation area >4m².

Hefei Chitherm Equipment Co., Ltd. is a professional enterprise engaged in the research and development, design, manufacturing, sales, maintenance and service of high, medium and low temperature industrial furnaces and experimental furnaces.

Our products include Bell Furnaces, Box Furnaces, Hot Air Dryer, Tube Furnaces, Vacuum Furnaces, Trolley Furnaces, and Rotary Furnaces. All of which are widely used in scientific research and experimentation in advanced ceramics, additive manufacturing, powder metallurgy, new energy and other fields. Suitable for the extrusion, sintering process of magnetic materials, honeycomb ceramics, alumina ceramics, zirconia ceramics, CIM/MIM, and positive and negative electrode materials of lithium batteries, as well as various other new materials such as pre-firing, extrusion, degreasing, firing, drying, co-firing, post-firing, soldering, curing, ceramic metallization, etc.

We insist responsible attitude towards customers and provide high-quality products and services. It is precisely because of the support, understanding, and trust of our customers and friends that our intelligent equipment manufacturing capabilities continue to improve. We are willing to work with customers to support the rapid development of electronis and advance materials all over the world.